基于SolidWorks Flow Simulation的热电制冷箱装配体安装架构的仿真优化

doi:10.12096/j.2096-4528.pgt.19085

摘要/Abstract

摘要：

为了提高热电制冷箱的制冷性能，对市面上常见的热电(半导体)制冷箱进行分析，并对制冷箱的制冷装配体与箱壁之间的架构方式进行探究。采用仿真工具SolidWorks Flow Simulation对制冷箱的制冷装配体与箱壁之间的架构方式进行建模仿真。分析了重力、风扇方向、开槽尺寸、槽内所加支架等参数对半导体制冷箱制冷性能的影响规律，结果表明：制冷箱在开槽尺寸一定时，重力方向处于箱体尺寸最长边，风扇进气方向为吸气，槽内加对称支架，并对支架的4个侧面做尽可能多的圆形镂空处理，且圆越大越好，此时热电制冷箱的制冷性能最优。

关键词: 热电制冷箱, SolidWorks Flow Simulation, 安装架构, 优化分析

Abstract:

In order to improve the refrigeration performance of thermoelectric refrigeration box, the common thermoelectric (semiconductor) refrigeration box on the market was analyzed, and the structure between the refrigeration assembly of the refrigeration box and the wall of the box was explored. SolidWorks Flow Simulation was used to model and simulate the structure between the refrigeration assembly and the wall of the refrigeration box. The effects of gravity, fan direction, groove size and bracket on the refrigeration performance of semiconductor refrigeration box were analyzed. It is concluded that when the groove size is fixed, the cooling performance of thermoelectric refrigeration box is optimal when the gravity direction is at the longest side of the box size, the direction of fan intake is suction and symmetrical bracket is added in the groove. The four sides of the support are cut out as many circles as possible, and the larger the circle is, the better.

Key words: thermoelectric refrigeration box, Solid-Works Flow Simulation, installation framework, optimal analysis

中图分类号:

TK172
TU831

邵夏勇, 张治国, 李国能, 叶阳辉, 邓斌, 王晴, ObinaniVictor Chimdike. 基于SolidWorks Flow Simulation的热电制冷箱装配体安装架构的仿真优化[J]. 发电技术, 2021, 42(3): 374-381.

Xiayong SHAO, Zhiguo ZHANG, Guoneng LI, Yanghui YE, Bin DENG, Qing WANG, Victor Chimdike Obinani. Simulation and Optimization of Assembly Structure of Thermoelectric Refrigeration Box Based on SolidWorks Flow Simulation[J]. Power Generation Technology, 2021, 42(3): 374-381.

图/表 12

表1 箱体部分尺寸参数

Tab. 1 Size parameters of box body

类别	长/mm	宽/mm	高/mm	误差/mm
内尺寸	280	170	140	±0.50
外尺寸	340	230	200	±0.50

表2 制冷装配体部分尺寸参数

Tab. 2 Partial dimensions of refrigeration assembly

类别	长/mm	宽/mm	高/mm
制冷片	40	40	4
硅脂	40	40	0.5
散热器翅片	4	1	7
散热器底座	40	40	3
风扇外尺寸	40	40	10

图1 热电制冷装配体与热电制冷箱的模型

Fig.1 Models of thermoelectric refrigeration assembly and thermoelectric refrigeration box

图2 热电制冷装配体与箱体的架构方式

Fig.2 Architecture of thermoelectric refrigeration assembly and box

图3 制冷箱仿真流程图

Fig.3 Flow chart of refrigeration box simulation

图4 热电制冷箱不开槽与开槽的部分仿真结果

Fig.4 Partial simulation results of slotting and slotting of thermoelectric refrigeration box

图5 “41.7缝隙”不加支撑架时，不同重力方向下箱内流体平均温度的变化

Fig.5 Change of average temperature of fluid in box under different gravity directions without support in "41.7 gap"

图6 “50缝隙”时所加支撑架形

Fig.6 Shape of supporting frame for "50 gap"

图7 “41.7缝隙”时所加支撑架形状

Fig.7 Shape of supporting frame for "41.7 gap"

表3 部分所加支撑架尺寸参数

Tab. 3 Dimensional parameters of brackets

类别	缝隙	厚度/mm	深度/mm
支撑1	50	10	10
支撑2	50	10	10
支撑3	50	10	10
支撑4	41.7	1.7	10
支撑5	41.7	1.7	10
支撑6	41.7	1.7	10
支撑7	41.7	1.7	10

图8 加支撑架时部分仿真结果图

Fig.8 Part of the simulation results with brackets

图9 温度场仿真表面图

Fig.9 Temperature field simulation surface diagram

参考文献 20

1	SAMIRA P . Application of thermoelectric as an instant running-water cooler; experimental study under different operating conditions[J]. Applied Energy, 2018, 229, 364- 374. DOI
2	SÖYLEMEZ E , ALPMAN E , ONAT A , et al. Numerical (CFD) and experimental analysis of hybrid household refrigerator including thermoelectric and vapour compression cooling systems[J]. International Journal of Refrigeration, 2019, 99, 300- 315. DOI
3	徐德胜. 半导体制冷与应用技术[M]. 上海: 上海交通大学出版社, 1992: 1
	XU D S . Semiconductor refrigeration and application technology[M]. Shanghai: Shanghai Jiaotong University Press, 1992: 1
4	时阳. 制冷技术[M]. 北京: 中国轻工业出版社, 2015: 4- 5.
	SHI Y . Refrigeration technology[M]. Beijing: China Light Industry Press, 2015: 4- 5.
5	朱凌云, 李国能, 康泰云, 等. 基于生物质燃料的水冷式温差发电机的实验研究[J]. 发电技术, 2019, 40 (2): 148- 154.
	ZHU L Y , LI G N , KANG T Y , et al. Experimental study on water cooled thermoelectric generator based on biomass fuel[J]. Power Generation Technology, 2019, 40 (2): 148- 154.
6	张晓芳, 钟建新, 杨穗. 水冷式半导体冰箱制冷性能的研究[J]. 工程设计学报, 2012, 19 (2): 105- 111. DOI
	ZHANG X F , ZHONG J X , YANG S . Study on refrigeration performance of water cooled semiconductor refrigerator[J]. Journal of Engineering Design, 2012, 19 (2): 105- 111. DOI
7	谢万蓉, 屈宗长, 刘公衍, 等. 半导体冰箱热管及变工况控制的研究[J]. 低温与超导, 2013, 41 (5): 69- 74. DOI
	XIE W R , QU Z C , LIU G Y , et al. Study on heat pipe and off design control of semiconductor refrigerator[J]. Low Temperature and Superconductivity, 2013, 41 (5): 69- 74. DOI
8	罗仲, 张旭, 王胜己, 等. 半导体制冷器除湿实验研究[J]. 制冷学报, 2015, 36 (5): 101- 106. DOI
	LUO Z , ZHANG X , WANG S J , et al. Experimental study on dehumidification of semiconductor cooler[J]. Acta Refrigeration Sinica, 2015, 36 (5): 101- 106. DOI
9	陶海波, 朱小兵, 朱文印, 等. 半导体冰箱热端热管散热器温度分布特性研究[A]. 中国家用电器协会. 2016年中国家用电器技术大会论文集[C]. 中国家用电器协会: 《电器》杂志社, 2016: 6.
	TAO H B, ZHU X B, ZHU W Y, et al. Study on the temperature distribution characteristics of the heat pipe radiator at the hot end of semiconductor refrigerator[A]. China Household Electrical Appliance Association. Proceedings of 2016 China Household Appliance Technology Conference[C]. China Household Appliance Association: electrical appliance magazine, 2016: 6.
10	张晓波, 徐象国. 多目标约束下半导体制冷片几何结构参数的优化设计[J]. 制冷学报, 2018, 39 (3): 22- 30. DOI
	ZHANG X B , XU X G . Optimization design of geometric structure parameters of semiconductor refrigeration chip under multi-objective constraints[J]. Acta Refrigeration Sinica, 2018, 39 (3): 22- 30. DOI
11	吴迪, 曾国辉, 丁倩云. 基于推挽式供电和PID温控的半导体冰箱系统设计[J]. 计算机测量与控制, 2018, 26 (11): 93- 97.
	WU D , ZENG G H , DING Q Y . Design of semiconductor refrigerator system based on push-pull power supply and PID temperature control[J]. Computer Measurement and Control, 2018, 26 (11): 93- 97.
12	GÖKÇEK M , ŞAHIN F . Experimental performance investigation of minichannel water cooled-thermoelectric refrigerator[J]. Case Studies in Thermal Engineering, 2017, 10, 54- 62. DOI
13	ÇAĞLARA. Optimization of operational conditions for a thermoelectric refrigerator and its performance analysis at optimum conditions[J]. International Journal of Refrigeration, 2018, 96, 70- 77.
14	MORIA H , AHMED M , ALGHANMI A , et al. Experimental study of solar based refrigerator using thermoelectric effect[J]. Energy Procedia, 2019, 158, 198- 203. DOI
15	MIRMANTO M , SYAHRUL S , WIRDAN Y . Experimental performances of a thermoelectric cooler box with thermoelectric position variations[J]. Engineering Science and Technology, an International Journal, 2019, 22 (1): 177- 184. DOI
16	DSSOLIDWORKS公司. SOLIDWORKS Flow Simulation教程[M]. 北京: 机械工业出版社, 2015.
	DS SolidWorks . SolidWorks flow simulation course[M]. Beijing: China Machine Press, 2015.
17	J.P. 霍尔曼(J.P. Holman). 传热学[M]. 北京: 机械工业出版社, 2011.
	HOLMAN J P. Heat transfer[M]. Beijing: China Machine Press, 2011.
18	孔祥谦. 热应力有限单元法分析[M]. 上海: 上海交通大学出版社, 1999.
	KONG X Q . Finite element analysis of thermal stress[M]. Shanghai: Shanghai Jiaotong University Press, 1999.
19	张显雄, 张志田, 张伟峰, 等. 五种湍流涡粘模型在二维方柱绕流数值模拟中的对比研究[J]. 空气动力学学报, 2018, 36 (2): 339- 349. DOI
	ZHANG X X , ZHANG Z T , ZHANG W F , et al. Comparison of five turbulence eddy viscosity models in two-dimensional numerical simulation of flow around a square cylinder[J]. Acta Aerodynamics, 2018, 36 (2): 339- 349. DOI
20	邵夏勇, ObinaniVictor Chimdike, 沈博, 等. 基于SolidWorks Flow Simulation的车载半导体制冷箱的仿真分析[J]. 浙江科技学院学报, 2019, 31 (5): 357- 364. DOI
	SHAO X Y , Obinani Victor Chimdike , SHEN B , et al. Simulation analysis of vehicle mounted semiconductor refrigeration box based on SolidWorks flow simulation[J]. Journal of Zhejiang University of Science and Technology, 2019, 31 (5): 357- 364. DOI